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Chips JU calls for pilot lines open for submission
The interrelated calls for pilot lines issued by the Chips JU are now open for submission.
The calls for pilot lines include:
- A call for expression of interest for the selection of a hosting consortium
- A call for proposals for Set-up, integration and process development, funded under Horizon Europe
- A call for proposals for the operational activities of the pilot line, funded under Digital Europe
The same application is submitted to those calls and the evaluation will consist of the simultaneous evaluation of the interrelated calls.
All calls are open for submission on the Funding & Tenders Portal:
Pilot line on advanced sub 2nm leading-edge system on chip technology
- Horizon Europe: HORIZON-Chips-2023-RIA-CPL-1 (Research and Innovation Action)
- Digital Europe: DIGITAL-Chips-2023-SG-CPL1 (Simple grant)
Pilot line on advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
- Horizon Europe: HORIZON-Chips-2023-RIA-CPL-2 (Research and Innovation Action)
- Digital Europe: DIGITAL-Chips-2023-SG-CPL-2 (Simple grant)
Pilot line on advanced Packaging and Heterogenous Integration
- Horizon Europe: HORIZON-Chips-2023-RIA-CPL-3 (Research and Innovation Action)
- Digital Europe: DIGITAL-Chips-2023-SG-CPL-3 (Simple grant)
Pilot line on advanced semiconductor devices based on Wide Bandgap materials
- Horizon Europe: HORIZON-Chips-2023-RIA-CPL-4
- Digital Europe: DIGITAL-Chips-2023-SG-CPL-4
Deadline for submission is 29 February 2024, 17.00 CET (Brussels time).
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